HBM3E
SK hynix HBM3E 8-Hi 24GB
24 GB eight-high HBM3E stack in volume production for AI accelerators
SK hynix · HBM stack (2.5D) · Image: skhynix.com
8-high HBM3E stack with 24 GB capacity and 9.2 Gbps per pin, proven in volume on shipping AI accelerator platforms.
- Interface
- HBM3E
- Form factor
- HBM stack (2.5D)
- Capacities
- 24 GB
In the High Bandwidth Memory portfolio
The 8-high HBM3E stack was the first extended-HBM3 product to reach volume production, supplying 24 GB per stack at 9.2 Gbps per pin — roughly 1.18 TB/s of bandwidth. It ships in high volume on current AI accelerator platforms across training and inference roles.
MR-MUF packaging and proven TSV yield give the 8-high stack a mature supply profile relative to newer 12-high parts, making it the volume anchor of HBM3E procurement. Thermal behavior and power draw per stack are correspondingly lower than 12-high configurations.
Verified specification
Figures as published by SK hynix. Availability and firmware options are confirmed at quotation.
| Interface | HBM3E, 1024-bit |
|---|---|
| Stack Height | 8-high |
| Capacity | 24 GB per stack |
| Data Rate | Up to 9.2 Gbps/pin |
| Bandwidth | ~1.18 TB/s per stack |
| Packaging | MR-MUF, TSV |
| Target | AI accelerators, HPC |
