High Bandwidth Memory

TSV-stacked high bandwidth memory from SK hynix and Samsung, from HBM2E through 12-high HBM3E, supplying the per-package bandwidth required by AI training and HPC silicon.

HBM3EHBM3HBM2E
01 — HBM3E

HBM3E

Fifth-generation extended HBM at 9+ Gbps per pin, up to 36 GB per stack.

02 — HBM3

HBM3

6.4 Gbps HBM in volume production for shipping accelerator platforms.

SK hynix · HBM3Mass Production

SK hynix HBM3 24GB

HBM3 stacks at 6.4 Gbps per pin and up to 24 GB, the memory of record for the first wave of large AI training GPUs.

16 GB24 GB
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03 — HBM2E

HBM2E

Proven HBM generation for HPC, networking, and FPGA designs.

Samsung · HBM2EMass Production

Samsung HBM2E Flashbolt

Flashbolt HBM2E at 3.6 Gbps per pin and 16 GB per stack, serving HPC, FPGA, and networking designs in sustained production.

Long Lifecycle16 GB
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Elsewhere in the portfolio

Sourcing from the High Bandwidth Memory portfolio? Availability and lead times, confirmed within one business day.