HBM2E
Samsung HBM2E Flashbolt
16 GB HBM2E for HPC, FPGA, and networking silicon still in production
Samsung · HBM stack (2.5D) · Image: samsung.com
Flashbolt HBM2E at 3.6 Gbps per pin and 16 GB per stack, serving HPC, FPGA, and networking designs in sustained production.
- Interface
- HBM2E
- Form factor
- HBM stack (2.5D)
- Capacities
- 16 GB
In the High Bandwidth Memory portfolio
Flashbolt HBM2E delivers 16 GB per 8-high stack at 3.6 Gbps per pin — about 460 GB/s of bandwidth. While AI training has moved to HBM3-class memory, HBM2E remains designed into FPGAs, network switches, and HPC processors with long production schedules.
For those installed programs, continued HBM2E supply is a lifecycle requirement rather than a performance choice. Samsung maintains production and qualification support, making Flashbolt the practical sourcing route for mid-life HBM2E platforms.
Verified specification
Figures as published by Samsung. Availability and firmware options are confirmed at quotation.
| Interface | HBM2E, 1024-bit |
|---|---|
| Stack Height | 8-high |
| Capacity | 16 GB per stack |
| Data Rate | 3.6 Gbps/pin |
| Bandwidth | ~460 GB/s per stack |
| Packaging | TC-NCF, TSV |
| Target | FPGA, networking, HPC |
