HBM3
SK hynix HBM3 24GB
6.4 Gbps HBM3 in proven volume production on shipping accelerator platforms
SK hynix · HBM stack (2.5D) · Image: skhynix.com
HBM3 stacks at 6.4 Gbps per pin and up to 24 GB, the memory of record for the first wave of large AI training GPUs.
- Interface
- HBM3
- Form factor
- HBM stack (2.5D)
- Capacities
- 16 GB24 GB
In the High Bandwidth Memory portfolio
HBM3 powered the first generation of large-scale AI training deployments, and SK hynix's 24 GB 12-high stack remains in volume production for shipping accelerator platforms. At 6.4 Gbps per pin the stack delivers about 819 GB/s of bandwidth.
For programs that qualified on HBM3 and continue to build, the part offers mature yield, stable pricing relative to HBM3E, and an established thermal envelope. 8-high 16 GB variants serve HPC and networking silicon with smaller capacity requirements.
Verified specification
Figures as published by SK hynix. Availability and firmware options are confirmed at quotation.
| Interface | HBM3, 1024-bit |
|---|---|
| Stack Height | 8-high / 12-high |
| Capacity | 16 GB / 24 GB per stack |
| Data Rate | 6.4 Gbps/pin |
| Bandwidth | 819 GB/s per stack |
| Packaging | MR-MUF, TSV |
| Target | AI accelerators, HPC, networking |
