DRAM Components

Component-level DRAM for board-level integration: DDR5 and DDR4 for compute, LPDDR5X and LPDDR4X for mobile and automotive, and GDDR7 and GDDR6 for graphics and accelerator designs.

DRAM Components — representative product

01 — DDR5

DDR5

DDR5 components in 16 Gb to 32 Gb densities for module and embedded designs.

02 — DDR4

DDR4

DDR4 components for legacy platforms and long-availability embedded programs.

03 — LPDDR

LPDDR

Low-power DRAM for smartphones, thin clients, automotive, and edge devices.

SK hynix · LPDDRMass Production

SK hynix LPDDR5X

LPDDR5X at 8533 Mbps per pin in packages up to 16 GB, powering flagship smartphones and edge AI devices.

8533 Mbps8 GB12 GB16 GB
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Samsung · LPDDRMass Production

Samsung LPDDR5X

Samsung LPDDR5X in 12 nm-class process, shipping at 8533 Mbps with 10.7 Gbps grades sampling for AI-era devices.

10.7 Gbps12 GB16 GB24 GB32 GB
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Samsung · LPDDRMass Production

Samsung LPDDR4X

LPDDR4X at 4266 Mbps with automotive temperature grades, the volume choice for IVI, telematics, and mid-range devices.

Automotive2 GB4 GB6 GB8 GB
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04 — GDDR

GDDR

High-bandwidth graphics DRAM for GPUs, accelerators, and network processors.

SK hynix · GDDRSampling

SK hynix GDDR7

16 Gb GDDR7 using PAM3 signaling at 32 Gbps and above, for next-generation graphics cards and AI inference accelerators.

PAM3New16 Gb
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Samsung · GDDRMass Production

Samsung GDDR6

16 Gb GDDR6 at 16–24 Gbps per pin, the shipping standard for graphics cards, consoles, and high-throughput FPGAs.

24 Gbps16 Gb
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