eMMC
Samsung eMMC 5.1
Cost-optimized managed NAND for entry mobile, IoT, and automotive designs
Samsung · 153-ball FBGA · Image: samsung.com
e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
- Interface
- e.MMC 5.1
- Form factor
- 153-ball FBGA
- Capacities
- 8 GB16 GB32 GB64 GB128 GB256 GB
In the Mobile & Embedded portfolio
eMMC 5.1 is the workhorse managed-NAND interface for entry smartphones, tablets, set-top boxes, smart TVs, and countless embedded designs. Samsung's parts run HS400 mode at up to 250 MB/s sequential read with capacities from 8 GB to 256 GB.
The integrated controller handles wear leveling, bad-block management, and ECC, letting host SoCs use simple MMC interfaces without NAND management burden. Automotive and industrial temperature grades extend the line into telematics, cluster, and factory applications.
Verified specification
Figures as published by Samsung. Availability and firmware options are confirmed at quotation.
| Interface | e.MMC 5.1, HS400 |
|---|---|
| Form Factor | 153-ball FBGA (11.5 x 13 mm) |
| Capacities | 8 GB to 256 GB |
| Sequential Read | Up to 250 MB/s |
| Sequential Write | Up to 125 MB/s |
| NAND Type | Samsung V-NAND TLC / MLC options |
| Features | Command queue, RPMB, secure erase |
| Temp Grades | Consumer, industrial, automotive |
