eMMC
Samsung eMMC 5.1
Cost-optimized managed NAND for entry mobile, IoT, and automotive designs
Samsung · 153-ball FBGA · Image: samsung.com
e.MMC 5.1 managed NAND in 8 GB to 256 GB capacities for entry devices, set-top boxes, and automotive systems.
- Interface
- e.MMC 5.1
- Form factor
- 153-ball FBGA
- Capacities
- 8 GB16 GB32 GB64 GB128 GB256 GB
01 — Overview
In the Mobile & Embedded portfolio
eMMC 5.1 is the workhorse managed-NAND interface for entry smartphones, tablets, set-top boxes, smart TVs, and countless embedded designs. Samsung's parts run HS400 mode at up to 250 MB/s sequential read with capacities from 8 GB to 256 GB.
The integrated controller handles wear leveling, bad-block management, and ECC, letting host SoCs use simple MMC interfaces without NAND management burden. Automotive and industrial temperature grades extend the line into telematics, cluster, and factory applications.
02 — Specifications
Verified specification
Figures as published by Samsung. Availability and firmware options are confirmed at quotation.
| Interface | e.MMC 5.1, HS400 |
|---|---|
| Form Factor | 153-ball FBGA (11.5 x 13 mm) |
| Capacities | 8 GB to 256 GB |
| Sequential Read | Up to 250 MB/s |
| Sequential Write | Up to 125 MB/s |
| NAND Type | Samsung V-NAND TLC / MLC options |
| Features | Command queue, RPMB, secure erase |
| Temp Grades | Consumer, industrial, automotive |
03 — Related Products
