MCP
SK hynix uMCP (LPDDR5X + UFS)
LPDDR5X DRAM and UFS storage combined in a single mobile package
SK hynix · uMCP BGA · Image: skhynix.com
UFS-based multichip package combining LPDDR5X and UFS 3.1 storage, saving board space in slim mobile designs.
- Interface
- LPDDR5X + UFS 3.1
- Form factor
- uMCP BGA
- Capacities
- 8+128 GB12+256 GB16+512 GB
In the Mobile & Embedded portfolio
The uMCP stacks LPDDR5X DRAM and UFS managed NAND in one package, cutting board footprint and simplifying routing for mid-range and slim smartphone designs. Combinations pair 8 to 16 GB of LPDDR5X with 128 to 512 GB of UFS 3.1 storage.
Single-package sourcing also consolidates procurement and qualification: one part number covers the memory subsystem. SK hynix supplies uMCP across consumer temperature grades with power characteristics tuned for battery-first duty cycles.
Verified specification
Figures as published by SK hynix. Availability and firmware options are confirmed at quotation.
| Interface | LPDDR5X + UFS 3.1 |
|---|---|
| Form Factor | uMCP BGA |
| DRAM | 8 GB / 12 GB / 16 GB LPDDR5X |
| Storage | 128 GB / 256 GB / 512 GB UFS |
| DRAM Data Rate | Up to 8533 Mbps/pin |
| Storage Read | Up to 2,100 MB/s |
| Operating Temp | -25°C to 85°C |
