MCP
Samsung eMCP (LPDDR4X + eMMC)
LPDDR4X and eMMC in one package for entry mobile and IoT devices
Samsung · eMCP BGA · Image: samsung.com
eMMC-based multichip package pairing LPDDR4X with eMMC 5.1 for entry smartphones, wearables, and connected devices.
- Interface
- LPDDR4X + e.MMC 5.1
- Form factor
- eMCP BGA
- Capacities
- 3+32 GB4+64 GB8+128 GB
In the Mobile & Embedded portfolio
The eMCP combines LPDDR4X DRAM with eMMC 5.1 managed NAND in a single BGA, the standard memory solution for entry smartphones, feature-rich wearables, and connected consumer devices. Typical configurations pair 3 to 8 GB of DRAM with 32 to 128 GB of storage.
One-package integration reduces board area, layer count, and assembly cost — decisive factors at entry price points. Samsung's vertical NAND and DRAM supply supports stable volume availability across long consumer product cycles.
Verified specification
Figures as published by Samsung. Availability and firmware options are confirmed at quotation.
| Interface | LPDDR4X + e.MMC 5.1 |
|---|---|
| Form Factor | eMCP BGA (11.5 x 13 mm) |
| DRAM | 3 GB / 4 GB / 6 GB / 8 GB LPDDR4X |
| Storage | 32 GB / 64 GB / 128 GB eMMC |
| DRAM Data Rate | Up to 4266 Mbps/pin |
| Storage Read | Up to 250 MB/s |
| Operating Temp | -25°C to 85°C |
