DDR5 RDIMM
SK hynix DDR5 RDIMM 128GB
TSV-stacked 128 GB RDIMM for maximum-capacity server memory configurations
SK hynix · RDIMM · Image: skhynix.com
128 GB DDR5 RDIMM using 3DS TSV packaging for in-memory database, virtualization, and large-model inference nodes.
- Interface
- DDR5
- Form factor
- RDIMM
- Capacities
- 128 GB
In the DRAM Modules portfolio
The 128 GB DDR5 RDIMM uses through-silicon-via (3DS) stacked packages to reach the highest capacity point in SK hynix's standard registered module line. Populating twelve channels with these modules brings a single socket to 1.5 TB and a dual-socket system to 3 TB of direct-attached DRAM.
Target workloads include SAP HANA-class in-memory databases, large-scale virtualization, and CPU-side memory for AI inference serving where model and KV-cache residency drives capacity demand. The module operates at up to 6400 MT/s at 1.1 V with full ECC support.
Verified specification
Figures as published by SK hynix. Availability and firmware options are confirmed at quotation.
| Interface | DDR5, 288-pin RDIMM |
|---|---|
| Form Factor | RDIMM |
| Capacities | 128 GB |
| Data Rate | Up to 6400 MT/s |
| Organization | 2Rx4, 3DS TSV, ECC |
| Voltage | 1.1 V |
| DRAM Type | SK hynix DDR5, TSV-stacked |
| Operating Temp | 0°C to 85°C |
